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论文共 18 篇作者统计合作学者相似作者
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Guan-Wei Chen, Yan-Cheng Lin, Chung-Hsiang Hsu,Tang-Yuan Chen,Chen-Chao Wang, Chin-Pin Hung, Hung-Kai Wang
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.1593-1598, (2024)
2024 International Conference on Electronics Packaging (ICEP)pp.249-250, (2024)
Jui-Cheng Yu, Heng-Chieh Chien,Chao-Yang Chiang,En-Chia Liu, Yu-Hsiang Chang,Hung-Hsien Huang,Tang-Yuan Chen,Chin-Li Kao,Chien-Neng Liao
Applied Thermal Engineering (2023): 120495
IEEE Transactions on Electron Devicesno. 1 (2023): 215-221
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.995-998, (2023)
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.721-726, (2023)
Dao-Long Chen, Hui-Jing Chang,Tang-Yuan Chen, Yung-Hsiang Hu, Ting-Bin Chen, Chi-Hung Pan,Yu-Shuo Yang,Sheng-Jye Hwang
2023 International Conference on Electronics Packaging (ICEP)pp.115-116, (2023)
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.1711-1719, (2022)
Jen-Hsien Wong,NanYi Wu,Wei-Hong Lai,Dao-Long Chen,Tang-Yuan Chen,Chung-Hao Chen, Yi-Hsien Wu,Yung-shun Chang,Chin-Li Kao,David Tarng,Teck Chong Lee,C. P. Hung
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.1074-1079, (2022)
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