基本信息
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Bio
Gongyue Tang received the B.E. degree in mechanical engineering from the Beijing University of Aeronautics and Astronautics, Beijing, China, in 1993, the M.E. degree in spacecraft design from the Chinese Academy of Space Technology, Beijing, in 1996, and the Ph.D. degree in mechanical engineering from Nanyang Technological University (NTU), Singapore, in 2005.
He was the Mechanical Analyst Team Leader with Dyson Operations Pte Ltd., Singapore, and a Principal Engineer with United Test and Assembly Center, Ltd., Singapore. He is currently working as a Research Scientist with the Institute of Microelectronics (IME), a research institute of the Science and Engineering Research Council, Agency for Science, Technology and Research (A*STAR), Singapore. His research interests include heat transfer, microfluidics, thermal management, and advanced cooling technologies for integrated circuit packages and microelectronics systems.
Research Interests
Papers共 92 篇Author StatisticsCo-AuthorSimilar Experts
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Huicheng Feng, Bin He,Gongyue Tang, Xiaowu Zhang,Boon Long Lau, Keng Yuen Jason, Jun Wei Javier Ong,Ming Chinq Jong
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.1569-1574, (2024)
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.478-485, (2024)
Yong Han,Gongyue Tang
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.1493-1497, (2024)
Huicheng Feng,Gongyue Tang,Xiaowu Zhang,Boon Long Lau,Ming Chinq Jong,Keng Yuen Jason Au, Jun Wei Javier Ong,King Jien Chui, Jun Li,Hongying Li,Duc Vinh Le,Jing Lou
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGYno. 3 (2024): 397-405
IECON 2023- 49th Annual Conference of the IEEE Industrial Electronics Societypp.01-06, (2023)
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.1005-1011, (2023)
Teck Guan Lim, Lin Zho,Sasi Kumar Tippabhotla, Ji Lin,Jong Ming Chinq,JiaQi Wu,Tang Gongyue,Eva Wai Leong Ching, Yong Chyn Ng,King Jien Chui, Wei Jia Lu, Chee Heng Goh,
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1838-1843, (2023)
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1989-1993, (2023)
Huicheng Feng,Gongyue Tang,Xiaowu Zhang,Boon Long Lau,Ming Chinq Jong, Keng Yuen Jason Au,King Jien Chui,Jing Lou,Hongying Li,Duc Vinh Le
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1964-1968, (2023)
Yong Han,Gongyue Tang
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.235-239, (2023)
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