Chrome Extension
WeChat Mini Program
Use on ChatGLM
VIPCreated with Sketch.
Research Interests

Papers共 372 篇Author StatisticsCo-AuthorSimilar Experts

By YearBy Citation主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
Single-Grain Cu Μ-Joint Formation Induced by Selective Under-Seed-Metallurgy for Hybrid Bonding
Murugesan Mariappan,Kiyoharu Mori,Masahiro Sawa, Jinta Nampo, Hiroyuki Hashimoto,Takafumi Fukushima
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.325-330, (2024)
Cited0Views0EIWOSBibtex
0
0
Liquid Surface Tension-Driven Chip Self-Assembly Technology with Cu-Cu Hybrid Bonding for High-Precision and High-Throughput 3D Stacking of DRAM
Du Zehua, Hiroshi Kikuchi, Hayato Hishinuma,Mariappan Murugesan,Tetsu Tanaka,Takafumi Fukushima
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.1335-1341, (2024)
Cited0Views0EIWOSBibtex
0
0
D2W Hybrid Bonding System Achieving High-Accuracy and High-Throughput with Minimal Configurations
Kentaro Mihara, Takashi Hare, Hirofumi Sakai, Shimpei Aoki, Toyoharu Terada,Mariappan Murugesan, Hiryuki Hashimoto,Hisashi Kino,Tetsu Tanaka,Takafumi Fukushima,Fumihiro Inoue,Akira Uedono
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.420-426, (2024)
Cited0Views0EIWOSBibtex
0
0
Multi-Functional Self-Assembled Monolayer for Chip-to-Chip and Chip-to-Wafer Hybrid Bonding
Murugesan Mariappan,Kiyoharu Mori, Akifumi Kurachi, Toru Imori,Toshiya Kojima, Wakako Nakano, Hiroyuki Hashimoto,Takafumi Fukushima
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.45-50, (2024)
Cited0Views0EIWOSBibtex
0
0
An Advanced Remote-Plasma Assisted Ozone-Ethylene Radical (OER) Process for Cu-SiO2 Hybrid Bonding Yield Enhancement
Tatsunori Shino,Mariappan Murugesan,Kiyoharu Mori, Bungo Tanaka, Eitaro Toyama, Tetsuya Nishiguchi,Takafumi Fukushima
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.2042-2046, (2024)
Cited0Views0EIWOSBibtex
0
0
Bendability Enhancement and Miniaturization of Through-X Via (TXV) Based on Flexible FOWLP with Tiny Cu Pillar Assembly
Atsushi Shinoda, Chang Liu, Akihiro Tominaga,Hisashi Kino,Tetsu Tanaka,Takafumi Fukushima
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.849-854, (2024)
Cited0Views0EIWOSBibtex
0
0
Copper Electrode Surface Features and Cu-SiO2Hybrid Bonding
M. Murugesan,M. Sawa,E. Sone,M. Motoyoshi,M. Koyanagi,T. Fukushima
2023 IEEE International 3D Systems Integration Conference (3DIC)pp.1-4, (2023)
Cited0Views0EIWOSBibtex
0
0
���集に寄せて
Takafumi Fukushima
Journal of Japan Institute of Electronics Packagingno. 6 (2023): 525-525
Cited0Views0Bibtex
0
0
Negative-Thermal-Expansion Gate Electrode to Introduce Tensile Strain into the Channel of MOSFETs for Mobility Enhancement
Hisashi Kino,Takafumi Fukushima,Tetsu Tanaka
2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)pp.1-3, (2023)
Cited0Views0EIWOSBibtex
0
0
Load More
Author Statistics

#Papers: 377

#Citation: 4661

H-Index: 29

G-Index: 53

Sociability: 6

Diversity: 3

Activity: 5

  • 合作者
  • 学生
  • 导师
No result temporarily, you can search similar Scholar with the same research interest
Data Disclaimer
The page data are from open Internet sources, cooperative publishers and automatic analysis results through AI technology. We do not make any commitments and guarantees for the validity, accuracy, correctness, reliability, completeness and timeliness of the page data. If you have any questions, please contact us by email: report@aminer.cn