Thomas Fritzsch

Thomas Fritzsch received the Diploma degree (M.Sc.) in electrical engineering from the Dresden University of Technology, Dresden, Germany, in 1997. Since 2001, he has been with the Fraunhofer Institute for Reliability and Microintegration, Berlin, Germany, where he is the Head of the group BeOL-, TSV- and Bump-Metallization and also a Research and Development Engineer and Project Manager in the field of advanced wafer level packaging solutions with a focus on pixel detector and sensor packaging applications.