基本信息
浏览量:52
![](https://originalfileserver.aminer.cn/sys/aminer/icon/show-trajectory.png)
个人简介
Thomas Chiarella received the M.Sc. degree in electronics from Institut Supérieur Industriel Catholique du Hainaut, Charleroi, Belgium, in 2002. He directly joined the Silicon Process and Device Technology Division, IMEC, as a Characterization Engineer and took part, as s device engineer in technology transfers (130nm, 90nm, 65nm, 14nm) and the baseline yield improvement. He takes part in IMEC’S Affiliation Program focusing on successful and efficient definition and evaluation of finFET, nanosheet, and CFET technologies. He is currently a Senior Researcher in charge of finFET and CFET device design. He has actively contributed to the Horizon 2020 ASCENT EU Project (Project no. 654384). In addition to own publications in ICMTS/ESSDERC proceedings and Solid-State Electronics journal, he contributed to more than 50 technical papers (mainly IEDM/VLSI).
研究兴趣
论文共 145 篇作者统计合作学者相似作者
按年份排序按引用量排序主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
JAPANESE JOURNAL OF APPLIED PHYSICSno. 4 (2024)
T. Chiarella,P. Matagne,H. Mertens,M. Hosseini, X. Zhou,P. Eyben,H. Arimura, A. Gupta, O. Richard,C. Drijbooms,R. Caluwaerts,N. Horiguchi,
2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)pp.1-3, (2024)
IEEE ACCESS (2023): 127725-127736
Stanislav Tyaginov,Barry O'Sullivan,Adrian Chasin, Yaksh Rawal,Thomas Chiarella, Camila Toledo de Carvalho Cavalcante,Yosuke Kimura,Michiel Vandemaele,Romain Ritzenthaler,Jerome Mitard,Senthil Vadakupudhu Palayam, Jason Reifsnider,
Extended Abstracts of the 2023 International Conference on Solid State Devices and Materials (2023)
VLSI Technology and Circuitspp.1-2, (2023)
2023 International Electron Devices Meeting (IEDM)pp.1-4, (2023)
加载更多
作者统计
合作学者
合作机构
D-Core
- 合作者
- 学生
- 导师
数据免责声明
页面数据均来自互联网公开来源、合作出版商和通过AI技术自动分析结果,我们不对页面数据的有效性、准确性、正确性、可靠性、完整性和及时性做出任何承诺和保证。若有疑问,可以通过电子邮件方式联系我们:report@aminer.cn