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个人简介
Sze Pei Lim received the bachelor’s degree from the National University of Singapore, Singapore, majoring in industrial chemistry with a focus in polymers.
She was a Research and Development Chemist. She was the Technical Manager of the Technical Support Team, Singapore. She has more than 25 years of experience mainly in the areas of PCB assembly and surface mount technology. She was a Technical Manager of Inventec Corporation, Taipei, Taiwan, for nine years, where she provided technical support and managed testing in the laboratory. She is the Regional Product Manager for Semiconductor Material, Malaysia. She manages the semiconductor product lines for the Asia region and works closely with the local sales team and R&D to understand and develop solutions for industry needs and requirements. She joined Indium Corporation, Utica, NY, USA, in 2007. Her current research interests included solder paste and flux formulation. Her current research interests include close collaboration with customers in developing materials and process, for fine-feature printing targeted at the SiP application, as well as for one-step OSP ball attach application.
Ms. Lim is an SMTA-certified Process Engineer and has earned her Six Sigma Green Belt.
研究兴趣
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2024 International Conference on Electronics Packaging (ICEP)pp.61-62, (2024)
2023 International Conference on Electronics Packaging (ICEP)pp.7-8, (2023)
2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT)pp.1-4, (2022)
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)pp.1-4, (2022)
2022 International Conference on Electronics Packaging (ICEP)pp.7-8, (2022)
2022 International Conference on Electronics Packaging (ICEP)pp.69-70, (2022)
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)pp.378-386, (2022)
2022 International Conference on Electronics Packaging (ICEP)pp.5-6, (2022)
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.1144-1152, (2022)
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