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论文共 198 篇作者统计合作学者相似作者
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2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-8, (2024)
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-9, (2024)
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-13, (2024)
ICPHMpp.312-319, (2023)
PCIM Europe 2023; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Managementpp.1-10, (2023)
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.722-726, (2023)
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-11, (2023)
Journal of Electronic Packagingno. 1 (2023)
Anu Mathew,Rainer Dudek,Alexander Otto,Christina Scherf,Sven Rzepka, Nilavzhagan Subhaiah,Kashmira Arvind Rane,Juergen Wilde
CIPS 2022; 12th International Conference on Integrated Power Electronics Systemspp.1-10, (2022)
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2022 IEEE 9TH ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, ESTCpp.203-209, (2022)
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作者统计
#Papers: 163
#Citation: 1155
H-Index: 19
G-Index: 27
Sociability: 6
Diversity: 1
Activity: 2
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