基本信息
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个人简介
Sung-Mao Wu was born in Kaohsiung, Taiwan, R.O.C., on January 1, 1971. He received the B.S.E.E. degree from the Fu Jen Catholic University, Taipei, Taiwan, R.O.C., in 1994, the M.S.E.E. degree from the Yunlin University of Science and Technology, Yunlin, Taiwan, R.O.C., in 1996, and is currently working toward the Ph.D. degree in electrical engineering at the National Sun Yat-Sen University, Kaohsiung, Taiwan, R.O.C.
研究兴趣
论文共 140 篇作者统计合作学者相似作者
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期刊级别
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2024 International Conference on Electronics Packaging (ICEP)pp.35-36, (2024)
2024 International Conference on Electronics Packaging (ICEP)pp.1-2, (2024)
2024 International Conference on Electronics Packaging (ICEP)pp.1-2, (2024)
Shin-Yi Hung,Sung-Mao Wu
2024 International Conference on Electronics Packaging (ICEP)pp.295-296, (2024)
2024 International Conference on Electronics Packaging (ICEP)pp.297-298, (2024)
2023 International Conference on Electronics Packaging (ICEP)pp.259-260, (2023)
Wei-Chiao Wang, Hsing-Chuan Peng, Yu-Cong Wang, Chia-Lin Hsieh,Sung-Mao Wu, Ming-Shan Lin,Yuan-Fu Ku
2023 International Conference on Electronics Packaging (ICEP)pp.227-228, (2023)
2021 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT)pp.1-3, (2021)
2021 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT)pp.1-4, (2021)
2021 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)pp.1-4, (2021)
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作者统计
#Papers: 140
#Citation: 789
H-Index: 21
G-Index: 24
Sociability: 5
Diversity: 3
Activity: 1
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