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System Scaling Technology, advanced packaging and 3D integration, technologies and techniques for the memory subsystem integration and neuromorphic computing
System Scaling Technology, advanced packaging and 3D integration, technologies and techniques for the memory subsystem integration and neuromorphic computing
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论文共 458 篇作者统计合作学者相似作者
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IEEE Transactions on Electron Devicesno. 6 (2023): 3215-3222
引用0浏览0EIWOS引用
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2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1633-1637, (2023)
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2023 60th ACM/IEEE Design Automation Conference (DAC)pp.1-6, (2023)
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Science (New York, N.Y.)no. 6668 (2023): 263-264
Haoxiang Ren,Krutikesh Sahoo, Ziyi Guo, Rishi Pugazhendhi, Zachary Wong, Tianyu Xiang,Timothy S. Fisher,Subramanian S. Iyer
2023 International Electron Devices Meeting (IEDM)pp.1-4, (2023)
IEEE Journal of Solid-state Circuitsno. 1 (2023): 111-123
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.2240-2246, (2023)
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Takafumi Fukushima, Tianyu Xiang, Harshit Ranjan, Niharika Tripathi,Chang Liu,Guangqi Ouyang,Randall Irwin,Subramanian S. Iyer
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.444-449, (2023)
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2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1614-1621, (2023)
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2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.601-605, (2023)
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