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个人简介
Sriram Srinivasan received the bachelor’s degree in chemical engineering from the University of Madras, Chennai, India, in 1998, and the master’s degree in chemical engineering from the University of Kansas, Lawrence, KS, USA, in 2000.
In 2000, he joined Intel Corporation, Chandler, AZ, USA, where he has been in the field of packaging for the last 18 years, and is currently a Principal Engineer and also responsible for package architecture and technology definition for Intel products. He is a recognized expert in the area of package architecture. He holds numerous patents in the area of electronic packaging. His current research interests include silicon-package-platform co-design to deliver optimized product and technology.
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论文共 7 篇作者统计合作学者相似作者
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IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)pp.1286-1292, (2021)
Arun Chandrasekhar,Vijaya Boddu, Erich Chuh,Krishna Bharath,Farzaneh Yahyaei-Moayyed,Srikrishnan Venkataraman,Sriram Srinivasan,Ram Viswanath, Huthasana Kalyanam, Ritesh Jain
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 10 (2019): 1952-1962
International Symposium on Microelectronicsno. 1 (2017): 000342-000345
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