基本信息
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Bio
B. J. Skromme (M'83–SM'93) was born in Giffnock, U.K., in 1957. He received the B.S. degree (with high honors) in electrical engineering from the University of Wisconsin-Madison in 1978 and the M.S. and Ph.D. degrees in electrical engineering from the University of Illinois at Urbana-Champaign in 1980 and 1985, respectively.
In 1984, he joined Bell Communications Research, Red Bank, NJ, as a Member of Technical Staff, where we worked on the characterization of III–V and II–VI materials for optoelectronic applications. He subsequently joined Arizona State University, Tempe, in 1989 as an Associate Professor with the Department of Electrical Engineering, where he is currently a Professor. He spent sabbatical leaves at Motorola in 1998–1999 and at Freescale Semiconductor in 2007–2008. He has more than 120 refereed publications related to compound semiconductors and graduated four Ph.D. and 13 M.S. students. His current research interests center on wide-bandgap compound semiconductor materials and devices, including SiC, GaN, and related materials.
Dr. Skromme is a member of the Materials Research Society, Tau Beta Pi, Eta Kappa Nu, and Sigma Xi. He chaired or cochaired the Compound Semiconductor Program Committee of the IEEE International Reliability Physics Symposium in 2004–2010.
Research Interests
Papers共 141 篇Author StatisticsCo-AuthorSimilar Experts
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FIEpp.1-9, (2021)
2020 ASEE Virtual Annual Conference Content Access Proceedings (2020)
Reference Module in Materials Science and Materials Engineering (2018)
2016 IEEE Frontiers in Education Conference (FIE)pp.1-9, (2016)
B. J. Skromme, P. J. Rayes, B. E. McNamara, V. Seetharam,X. Gao, T. Thompson,X. Wang, B. Cheng,Y.-F. Huang,D. H. Robinson
Brian J. Skromme, Paul Rayes,Bing Cheng,Brian Mcnamara, Aaron S. Gibson,Angela Barrus,John M. Quick,Robert Kenneth Atkinson,Yih-Fang Huang,Daniel H. Robinson
2014 ASEE ANNUAL CONFERENCE (2014)
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Author Statistics
#Papers: 144
#Citation: 3529
H-Index: 31
G-Index: 56
Sociability: 6
Diversity: 1
Activity: 0
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