基本信息
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个人简介
Si Chen received the B.E. degree in materials science from Hohai University, Nanjing, China, in 2011, and the Ph.D. degree from the Beijing University of Technology, Beijing, China, in 2017.
Since 2019, she has been a Senior Engineer with the Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, China Electronic Product Reliability and Environmental Testing Research Institute. She has published well over 26 papers to journals and international conferences, and hold four patents. Her current research interests are focused on reliability issues of TSV stacking integration.
研究兴趣
论文共 73 篇作者统计合作学者相似作者
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CRYSTALSno. 1 (2024): 37
Haozhong Wang, Junshan Xiang, Bingxu Ma, Feng Tian,Xiangxiang Zhong,Xiaodong Jian,Si Chen,Hongtao Chen,Xiaofeng Yang
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 99 (2024): 1-1
SOLDERING & SURFACE MOUNT TECHNOLOGY (2024)
2023 24th International Conference on Electronic Packaging Technology (ICEPT)pp.1-4, (2023)
APPLIED SCIENCES-BASELno. 14 (2023): 8301-8301
Mingrui Zhao,Xiaodong Jian,Si Chen, Minghui Chen, Gang Wang,Tao Gong, Yangning Tian,Xiangjun Lu,Zhenbo Zhao,Xiaofeng Yang
CRYSTALSno. 12 (2023)
Microelectronics Journal (2023): 105982-105982
ADVANCED MATERIALS INTERFACESno. 4 (2023)
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作者统计
#Papers: 75
#Citation: 241
H-Index: 9
G-Index: 14
Sociability: 5
Diversity: 0
Activity: 1
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