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个人简介
Shizhao Wang received the B.S. degree from the Nanjing Institute of Technology, Nanjing, China, in 2016. He is currently pursuing the Ph.D. degree with Wuhan University, Wuhan, China.
His current research interests include back end of line (BEOL) interconnects under multiscale coupling, 3-D integrated circuit (IC) stacking, fan-out package, heterogeneous integration technology, and exploring the delamination issue in advanced package.
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论文共 22 篇作者统计合作学者相似作者
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IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 99 (2024): 1-1
Materials Science in Semiconductor Processing (2024): 108340
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGYno. 1 (2024): 61-70
2023 24th International Conference on Electronic Packaging Technology (ICEPT)pp.1-5, (2023)
2023 24th International Conference on Electronic Packaging Technology (ICEPT)pp.1-5, (2023)
2023 24th International Conference on Electronic Packaging Technology (ICEPT)pp.1-6, (2023)
Microsystems & Nanoengineeringno. 1 (2023): 1-10
Fundamental Research (2023)
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