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个人简介
1. PROF. (Dr.) SHIV DAYAL PANDEY
Dean,
Uttaranchal University, Dehradun, Uttarakhand
(NAAC A+ Grade Accredited)
Mob. No.: 9415444436; 7818943407; sdpmnnit@gmail.com
2. EDUCATIONAL QUALIFICATION:
• B.Tech.(Mechanical Engineering), M.Tech.(IIT, BHU, Varanasi), Ph.D.(MNNIT, Allahabad), IAENG(U.K).
• Four times GATE qualified.
3. ACHIEVEMENTS:
• Worked as a Provost (Pro.VC) at Dr. K.N.Modi University , Jaipur, Rajasthan (NAAC Accredited).
• Formerly Director at Dr. K.N.Modi Foundation, Modinagar, Delhi-NCR (NBA Accredited).
• Formerly Director at K.N.I.P.S.S., Sultanpur, U.P.
• NAAC/NIRF/NBA Accreditation Specialist.
• Worked for NAAC accreditation with Uttaranchal University, Dehradun & earn NAAC A+ Grade.
• Successfully completed NBA accreditation at Dr. KNMIET, Modinagar and get three years provisionally accreditation.
• NEP-2020 implementation in current process.
• Academic, Administration, Examinations works, Placement, UGC/AICTE Compliances, lead-for NAAC-Accreditation, Chairman of Policy Making, BOS Chairman .
• Visiting professor at IITs, NITs & esteemed Universities in India and abroad.
• Consultancy to PHE industries in India and abroad (Canada, California, Switzerland, Germany etc.)
• Supervised 6 Ph.D. & 3 Ph.D. under process, 15 M.Tech. & 57 B.Tech. Students.
• Organized and Coordinated 25+ FDP, MDP & Conference/Seminar with coordination of IIT BHU, IITR, NIIT, Chandigarh, AICTE, DST & DRDO.
• Member of numbers of professional societies and organization like Academic council member of UPTU, Lucknow, IEEE, IE India, Elsevier etc. AICTE expert committee member (1-2170902331).
• Editor and Editor in chief of International Journal of Engineering and Science ‘ISSN-2348-3302’ & seven Engineering Books and Souvenir.
• Completed four sponsored research & consultancy projects founded Rs. 15L, 10L, 18L& 20L by reputed Industries & organizations as a principal investigator.
• Reviewer of Elsevier, Taylor & Francis, Willey, Springer, IEEE journals.
• Exposure of working of various important and apex bodies of a university like, BOM, Academic Council, Board of Inspection, Finance Committee, Research Board, Faculty, and Board of Studies.
• Root level experience of preparing schemes and syllabi for undergraduate and post graduate courses being, Dean and Chairman of Board of Studies (BOS) and member of board of studies.
• Exposure to manage examinations and Experience of providing technical consultancy.
4. ACADEMIC & INDUSTRIAL EXPERIENCE:
• 25+ years (after Ph.D. more than 10-year experience) Glorious Teaching experience with Administration experience.
• 2 years Industry experience in HCC Mumbai.
• 7 years research experience from IIT, BHU, Varanasi and MNNIT, Allahabad.
5. DETAILS OF PATENTS & PAPER PUBLISHED:
• PATENTS: 12 (National & International)
• 75+ research papers published in International and National Journals, Conferences & Seminar.
• 350+ citation, 15 h –index (Google Scholar Result), 11 patents in field of PHE and IoT.
6. AWARDS AND HONORS:
• IIT, BHU, Varanasi awarded Honors degree in M.Tech. program.
• Best Director award by CEE, New Delhi in association with UPTU, Lucknow on 6th Sep. 2014.
7. EDITORSHIP:
1. Associate Editor, Journal of Thermal Analysis and Calorimetry (Springer).
2. Members of Editorial Board, International Journal of Experimental Thermal and Fluid Science (Elsevier)
3. Members of Editorial Board, Journal of Mechanical Engineering research.
4. Members of Editorial Board, the open Mechanical Engineering Journal.
研究兴趣
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2023 4th IEEE Global Conference for Advancement in Technology (GCAT)pp.1-6, (2023)
Yashwant Singh Bisht,Shiv Dayal Pandey, Sanjeev Kumar Shah, Ajay Nautiyal, Poonam Rawat, Manish Ghalwan
Nucleation and Atmospheric Aerosols (2023)
Amandeep Singh,Sanjeev Kumar Joshi, Dharmendra Kumar,Rajiv Kumar,Shiv Dayal Pandey, Madhur Thapliyal
2023 6th International Conference on Contemporary Computing and Informatics (IC3I) (2023): 1159-1164
2022 International Conference on Advances in Computing, Communication and Materials (ICACCM)pp.1-5, (2022)
2022 International Conference on Advances in Computing, Communication and Materials (ICACCM)pp.1-6, (2022)
2022 International Conference on Advances in Computing, Communication and Materials (ICACCM)pp.1-4, (2022)
International journal of energy engineering (2016): 7-13
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