基本信息
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Bio
Sharon Lim Pei Siang received the B.Tech. degree in manufacturing engineering from the National University of Singapore in 2002, and the M.Sc. degree in mechanics and processing of materials from Nanyang Technological University in 2005. She was a Senior Engineer with Assembly Interconnect Technology Group, Infineon Technologies. Since 2008, she has been a Senior Research Engineer with the Institute of Microelectronics, Agency for Science Technology and Research. She has authored/coauthored over 20 journal papers and conference papers. Her research interests include wafer-level packaging, fine pitch interconnects, Cu/low-k packaging, 3-D stacked module, and package reliability.
Research Interests
Papers共 56 篇Author StatisticsCo-AuthorSimilar Experts
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Chai Tai Chong, Mihai Rotaru, Wang Xiangyu,Sharon Lim Pei Siang, Ji Lin,Rathin Mandal, Raju Mani,Jong Ming Chinq,Ye Yong Liang
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.2017-2023, (2024)
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.132-138, (2023)
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.734-737, (2023)
Chai Tai Chong,Lau Boon Long,Sharon Lim Pei Siang,David Ho Soon Wee,Rob van Kampen,Paul Castillou,Roberto Gaddi, Lance Barron,Mickael Renault, Jay Ko, Jonathan Hammond
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.24-28, (2023)
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.24-28, (2023)
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (2022)
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)pp.945-950, (2022)
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)pp.707-711, (2022)
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.635-642, (2022)
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Author Statistics
#Papers: 54
#Citation: 200
H-Index: 8
G-Index: 10
Sociability: 5
Diversity: 1
Activity: 1
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