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个人简介
Shan-Bo Wang received the M.S. degree in materials science and engineering from National Taiwan University, Taipei, Taiwan, in 2018.
He has been with the Research and Development Material Laboratory, Advanced Semiconductor Engineering (ASE) Group, Kaohsiung, Taiwan, since 2019. He is currently engaged in the research project of electromigration research and process improvement.
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论文共 9 篇作者统计合作学者相似作者
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Surface and Coatings Technologypp.130828, (2024)
Surface and Coatings Technology (2024)
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)pp.330-334, (2022)
International Symposium on Microelectronicsno. 1 (2021): 000136-000141
Chien Lung Liang, Yung Sheng Lin, Chin Li Kao,David Tarng,Shan Bo Wang, Yun Ching Hung, Gao Tian Lin,Kwang Lung Lin
2020 IEEE 70th Electronic Components and Technology Conference (ECTC)pp.361-366, (2020)
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 9 (2020): 1438-1445
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 9 (2020): 1438-1445
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