基本信息
浏览量:2
职业迁徙
个人简介
Seung-Ho Kim received the B.Sc. and M.Sc. degrees in materials science and engineering from the Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Korea, in 2008 and 2010, respectively, and the Ph.D. degree from the Department of Materials Science and Engineering, KAIST, in 2015.
He was a Primary Researcher in touch screen panel assemblies using the ACF ultrasonic bonding process joint research project being carried out by Samsung Electro-Mechanics, Suwon, Korea, and KAIST. His current research interests include the development of self-fluxing solder anisotropic conductive films for flex-on-board assemblies.
研究兴趣
论文共 15 篇作者统计合作学者相似作者
按年份排序按引用量排序主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
Components, Packaging and Manufacturing Technology, IEEE Transactions no. 1 (2015): 9-14
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 99 (2015): 1-1357
Components, Packaging and Manufacturing Technology, IEEE Transactions no. 1 (2015): 3-8
Components, Packaging and Manufacturing Technology, IEEE Transactionsno. 12 (2013): 2156-2163
加载更多
作者统计
合作学者
合作机构
D-Core
- 合作者
- 学生
- 导师
数据免责声明
页面数据均来自互联网公开来源、合作出版商和通过AI技术自动分析结果,我们不对页面数据的有效性、准确性、正确性、可靠性、完整性和及时性做出任何承诺和保证。若有疑问,可以通过电子邮件方式联系我们:report@aminer.cn