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He has been involved in several projects related to electronics packaging in cooeration with the Integrated Electronics Engineering Center (IEEC), which includes a broad range of industry as members. His expertise in micro/nanomechanics and optomechanics contributes to the center in conducting on-going and prospective projects.
Park began his professional career at IBM Microelectronics Division, where he conducted numerous analyses to put products out on time. Later, he was engaged in the reliability engineering responsible for the reliability of flip-chip technology and high performance packaging.
Park served as a panelist for the Yield Learning Conference hosted by IBM Academy of Technology. He spent over six years at the IBM Microelectronics Division in Endicott and East Fishkill, NewYork.
Park began his professional career at IBM Microelectronics Division, where he conducted numerous analyses to put products out on time. Later, he was engaged in the reliability engineering responsible for the reliability of flip-chip technology and high performance packaging.
Park served as a panelist for the Yield Learning Conference hosted by IBM Academy of Technology. He spent over six years at the IBM Microelectronics Division in Endicott and East Fishkill, NewYork.
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Society for Standards Certification and Safetyno. 1 (2024): 1-10
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.907-913, (2023)
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2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.303-309, (2023)
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IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 5 (2023): 638-645
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Lecture notes in mechanical engineeringpp.453-460, (2023)
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2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1773-1778, (2023)
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IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 9 (2023): 1388-1398
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2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.840-845, (2023)
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SOLDERING & SURFACE MOUNT TECHNOLOGY (2023)
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