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个人简介
Seung Wook Yoon (M'05) received the Ph.D. degree in materials science and engineering from the Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Korea, in 1998.
He joined the Hyundai Electronics (Hynix Semiconductor), Ichon, Korea, in 1998 and worked as a Member of Technical Staff at Advanced Electronic Packaging and Module Development. He worked for the development of lead-free solder applications, multichip packaging, CSPs, wafer-level CSP and was involved in JEDEC 11 activity. He joined the Institute of Microelectronics, Singapore, in 2002 and works in the Microsystems, Modules, and Components Laboratory as a Senior Research Engineer. His major interest fields are Cu/low-k/ultralow-k packaging, 3-D silicon micromodule technology, and wafer-level integration and microsystem packaging. He has over 30 conference and journal papers on microelectronic materials and electronic packaging.
研究兴趣
论文共 156 篇作者统计合作学者相似作者
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Dapeng Wu,Robin Dahlback,Erik Ojefors,Mats Carlsson, Francis Chee Peng Lim, Yew Kheng Lim,Aung Kyaw Oo,Won Kyung Choi,Seung Wook Yoon
International Symposium on Microelectronicsno. 1 (2018): 000252-000258
2018 International Wafer Level Packaging Conference (IWLPC) (2018)
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作者统计
#Papers: 156
#Citation: 2518
H-Index: 28
G-Index: 43
Sociability: 6
Diversity: 2
Activity: 0
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