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个人简介
Seung-Jin Oh received the B.S. and M.S. degrees in mechanical engineering from the Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea, in 2018 and 2020, where he is currently pursuing the Ph.D. degree with the Advanced Packaging and Thin Film Laboratory.
His current research interests include experimental measurement for understanding mechanical properties of electronic materials or brittle thin films and adhesion evaluation for improving reliability of electronic devices.
研究兴趣
论文共 15 篇作者统计合作学者相似作者
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SMALL METHODSpp.e2301220-e2301220, (2024)
Yongmin Jeon,Tae‐Yun Lee,Minwoo Nam, Hyeongjun Lee, Hyeunwoo Kim,Sun‐Woo Lee,Seung Jin Oh,Seungyeop Choi,Jun‐Yeong Yang,Sunghoon Jung,Seunghun Lee,Eun‐Yeon Byeon,
Advanced Functional Materialsno. 18 (2024)
Yongmin Jeon,Tae-Yun Lee,Minwoo Nam, Hyeongjun Lee,Hyeunwoo Kim,Sun-Woo Lee,Seung Jin Oh,Seungyeop Choi,Jun-Yeong Yang,Sunghoon Jung, Seunghun Lee,Eun-Yeon Byeon,
ADVANCED FUNCTIONAL MATERIALS (2023)
Min Kyu Kim, Young Seung Choi, Dooho Kim, Kang Heo,Seung Jin Oh,Sujeong Lee, Jeongho An, Hyeonjae Yoo, Sang Hoon Kim,Taek-Soo Kim,Byungha Shin
ACS APPLIED MATERIALS & INTERFACESno. 49 (2023): 57404-57414
Materials horizonsno. 10 (2023): 4488-4500
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Materials horizonsno. 10 (2023): 4488-4500
JOURNAL OF MATERIALS CHEMISTRY C (2023)
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