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Scott Pollard received the undergraduate degree in mechanical engineering technology from the SUNY Institute of Technology in 1990, and the M.S. degree in mechanical engineering from RPI in 1996. He has over 30 years of experience in the fields of electronics, microelectronics, optoelectronics packaging, and related process development having worked on military avionics components with Lockheed Martin and optical components for Alcatel Network Systems before joining Corning Incorporated in 2001. Since then, he has held design and leadership roles on various projects ranging from Photonic components to Solid Oxide Fuel Cells to Flexible Electronics. He is co-inventor on ten U.S. patents and coauthored on over 40 publications. He is currently a Research Director with continuing interests in glass for the electronics packaging industry including substrates for millimeter-wave circuitry, and sensors.
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论文共 17 篇作者统计合作学者相似作者
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IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.1211-1217, (2022)
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)pp.304-309, (2021)
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)pp.1660-1666, (2021)
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)pp.954-958, (2021)
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