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个人简介
I have co-authored two books, three book chapters, and published over 80 papers in journals and conference/workshop proceedings. I have delivered several invited talks and have been panelist at several conferences. I hold 21 U.S. and 5 European patents and have over 30 other patents pending. I was a recipient of the Most Significant Paper Award at the IEEE International Test Conference in 2010. I serve on various conference committees and IEEE Standardization groups including DATE, ETS, DAC, ITC, VLSI-DAT, 3DTest, and IEEEP1838. I was the General Chair of 3D Workshop at DATE 2012. I am a senior member of the IEEE. My current research interests include all topics in the domain of testing, stacking, diagnosis and failure analysis of 2D/3D chips in sub-nanometer (10nm and below) technologies. In my free time, I like listening to music, swimming or cooking/baking. I plan to have my own book series on traditional and modern cooking sometime in future
研究兴趣
论文共 118 篇作者统计合作学者相似作者
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IEEE European Test Symposiumpp.1-4, (2024)
A. K. Mehta, Akshay Bafna,Sandeep Goel, A.K. Trivedi, Chandrakanta Mishra, Preethi Naik,Nitin Zalte,Amarnath Sugumaran
Endocrine Abstracts (2023)
Anshuman Chandra, Moiz Khan, Ankita Patidar, Fumiaki Takashima,Sandeep Kumar Goel, Bharath Shankaranarayanan, Vuong Nguyen, Vistrita Tyagi, Manish Arora
2023 IEEE International Test Conference (ITC)pp.11-20, (2023)
Handbook of 3D Integrationpp.81-114, (2019)
Handbook of 3D Integrationpp.253-280, (2019)
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