基本信息
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个人简介
Saket Karajgikar received the B.E. degree in mechanical engineering from the University of Pune, Pune, India, in 2002, and the M.S. degree in mechanical engineering from the University of Texas, Arlington, in 2004. He is currently pursuing the Ph.D. degree in mechanical engineering from the Department of Mechanical Engineering, University of Texas, with research focused on developing design guidelines for thermal management of electronic packages.
Since 2002, he has authored and coauthored several conferences and journal publications related to electronic packaging. His current research interest includes addressing thermal and packaging challenges from die to system level.
研究兴趣
论文共 33 篇作者统计合作学者相似作者
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PROCEEDINGS OF ASME 2022 INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, INTERPACK2022 (2022)
PROCEEDINGS OF ASME 2022 INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, INTERPACK2022 (2022)
PROCEEDINGS OF ASME 2022 INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, INTERPACK2022 (2022)
semanticscholar(2021)
Journal of Electronic Packaging (2021)
PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION 2010, VOL 4pp.397-404, (2012)
PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION 2010, VOL 4pp.417-+, (2012)
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作者统计
#Papers: 33
#Citation: 131
H-Index: 7
G-Index: 10
Sociability: 4
Diversity: 1
Activity: 9
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