基本信息
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Career Trajectory
Bio
Saif Wakeel received the B.Tech. degree (Hons.) in mechanical engineering from Aligarh Muslim University, Aligarh, India, in 2018. He is currently pursuing the Master of Engineering Science by Research degree with the University of Malaya, Kuala Lumpur, Malaysia.
He was a Research and Development Intern at NXP Semiconductors, Malaysia, for two years during his master’s degree. He has completed eight months Erasmus+ fellowship program at Dicle Universitesi, Diyarbakir, Turkey. He was a Research Intern at the National University of Singapore (NUS), Singapore. His research interests include characterization of fluxes and underfills, reliability of fine pitch flip-chip packaging, failure analysis of microelectronic packaging, high-temperature sintered paste for radio frequency packaging, and multicriteria decision making (MCDM) modeling for material and supplier selection. To date, he has authored 15 research articles in good journals, a book chapter, and two invited books. His current standing of citations is 120 with H-index of 5. He is a six-sigma yellow belt holder.
Research Interests
Papers共 17 篇Author StatisticsCo-AuthorSimilar Experts
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.804-808, (2023)
Journal of Engineering Science and Technology Reviewno. 1 (2022): 24-33
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 8 (2022): 1386-1394
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 1 (2022): 155-167
M. Nasir Bashir, Muhammad Nihal Naseer,M. M. Quazi,M Saif Wakeel, Imran Ali,Manzoore Elahi M Soudagar,Jahanzeb Bhatti
Journal of ICT, design, engineering and techological scienceno. 2 (2021)
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Author Statistics
#Papers: 16
#Citation: 247
H-Index: 7
G-Index: 15
Sociability: 4
Diversity: 0
Activity: 1
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