基本信息
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个人简介
Steffen Wiese (Member, IEEE) received the Diploma and Ph.D. degrees in electrical engineering from Technische Universität Dresden, Dresden, Germany, in 1995 and 2000, respectively.
He was with the Module Technology Group, Fraunhofer CSP, Halle (Saale), Germany. He is currently a Professor with the Department of Systems Engineering, Saarland University, Saarbrücken, Germany. His current research interests include photovoltaic packaging and mechanics of electronic packaging materials and soldering.
研究兴趣
论文共 154 篇作者统计合作学者相似作者
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2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-5, (2024)
Advanced Engineering Materials (2024)
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 1 (2024): 122-129
Materials (Basel, Switzerland)no. 11 (2024): 2702
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-5, (2024)
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-5, (2023)
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)no. EMPC (2023): 1-6
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-5, (2023)
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-8, (2022)
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-8, (2022)
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作者统计
#Papers: 155
#Citation: 1837
H-Index: 23
G-Index: 38
Sociability: 5
Diversity: 1
Activity: 1
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