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个人简介
After graduating with a M.S. in Industrial and Systems Engineering (ISE) from SUNY-Binghamton with a specialization in Electronics Manufacturing, I began my professional career at Koki Solder America Inc.
The research in electronics manufacturing began when I was offered a research associate position at Universal Instrument’s Advanced Process Lab while I was working on my Masters’ degree in ISE from SUNY – Binghamton. I was part of the team which conducted a multimillion-dollar manufacturing research effort sponsored by an international consortium of companies from across the electronics industry. From characterization of various lead-free solder alloys to optimizing process parameters for newly developed electronics packages I was involved in multiple research projects which gave me a broader horizon of the industry. I was also involved with couple of industry leading projects establishing correlation between microstructure and reliability of the lead-free solder joints.
The exciting professional journey with KOKI, not only involved leading business growth in North Americas but also involved collaborating with leading engineers and scientists in electronics manufacturing to research and solve issues related with reliability of electronic packages. The results of my findings have been published in various journals articles, IEEE as well as SMTA International conference papers and a book chapter published by Wiley Publication. Some of my research owing to non-disclosure agreements with Fortune 500 companies have been published only to the audience of respective companies.
In my most recent role as the Engineering Manager, I work across cross functional teams offering management, materials development, finance, and program management teams to define the strategy and roadmap, drive new technology investigations, and propose high-level inputs in designing of soldering fluxes.
The collaboration with the engineers and scientists propelled me to do further research in Electronics Manufacturing so applied for PhD program in ISE at SUNY – Binghamton in 2017. I began the program part-time in Fall of 2017 and successfully cleared my qualifier exam in Spring 2021. I have already started to work on my research in reliability assessment of high reliability solder alloys for automotive applications. I also teach (part of) couple of graduate level courses at SUNY Binghamton focusing on processes for electronics manufacturing.
研究兴趣
论文共 12 篇作者统计合作学者相似作者
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ADVANCED ELECTRONIC MATERIALSno. 4 (2023)
Lead‐free Soldering Process Development and Reliabilitypp.73-93, (2020)
semanticscholar(2017)
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semanticscholar(2017)
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INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION - 2012, VOL 9, PTS A AND Bpp.467-473, (2013)
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作者统计
#Papers: 11
#Citation: 117
H-Index: 5
G-Index: 7
Sociability: 4
Diversity: 1
Activity: 2
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