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Bio
His research interests include computational electromagnetics, transmission line and waveguide discontinuities, microwave and millimeter wave planar circuits, and interconnection modeling and design for advanced packaging. He has authored more than 300 papers in international journals and conferences, and a couple of domestic and American patents,
He is a member of the Phi Tau Phi Scholastic Society, the Chinese Institute of Engineers, the Chinese Institute of Electrical Engineers, the Institute of Electrical and Electronics Engineers (IEEE), and the International Union of Radio Science (URSI). He served on editorial works for several international journals, including Associate Editor of the Journal of Chinese Institute of Electrical Engineering in 1996, Associate Editor of IEEE Transactions on Microwave Theory and Techniques in 2005-08, and Associate Editor of the IEEE Transactions on Advanced Packaging which later become IEEE Transactions on Components, Packaging, and Manufacturing Technology, in 2009-13.
He is a member of the Phi Tau Phi Scholastic Society, the Chinese Institute of Engineers, the Chinese Institute of Electrical Engineers, the Institute of Electrical and Electronics Engineers (IEEE), and the International Union of Radio Science (URSI). He served on editorial works for several international journals, including Associate Editor of the Journal of Chinese Institute of Electrical Engineering in 1996, Associate Editor of IEEE Transactions on Microwave Theory and Techniques in 2005-08, and Associate Editor of the IEEE Transactions on Advanced Packaging which later become IEEE Transactions on Components, Packaging, and Manufacturing Technology, in 2009-13.
Research Interests
Papers共 283 篇Author StatisticsCo-AuthorSimilar Experts
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COMPUTER COMMUNICATIONS (2024): 179-187
MICROMACHINESno. 1 (2024): 89
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 99 (2024): 1-1
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGYno. 1 (2024): 81-88
2023 Asia-Pacific Microwave Conference (APMC)pp.177-179, (2023)
IEEE Access (2023): 19418-19427
IEEE Internet of Things Journalno. 9 (2023): 8319-8326
2023 ASIA-PACIFIC MICROWAVE CONFERENCE, APMCpp.177-179, (2023)
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