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论文共 23 篇作者统计合作学者相似作者

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Warpage behavior of the flip chip package in underfill curing process: in situ characterization and numerical simulation
Yixuan Fan,Liang Peng, Zhen’An Zhang,Gang Li, Danning Zhao, Zhenguo Zhang,Rong Sun,Pengli Zhu
2023 24th International Conference on Electronic Packaging Technology (ICEPT)pp.1-5, (2023)
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Simulation of performance and reliability of nanocopper paste in power device packaging
Tongtong Wang,Liang Xu,Pengli Zhu,Tao Zhao,Rong Sun
2023 24th International Conference on Electronic Packaging Technology (ICEPT)pp.1-5, (2023)
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Numerical study of the effect of epoxy molding compound gradation on the thermo-mechanical properties of package
Xiaoxin Lu, Yu Zhou, Dongdong Ding,Sun Rong,Jibao Lu
2023 24th International Conference on Electronic Packaging Technology (ICEPT)pp.1-4, (2023)
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Ad/desorption mechanism of amine-terminated polyoxypropylene suppressor in advanced acid copper electroplating
Ning Zhang,Zhe Li,Rui-Xun Wang,Zhi-Quan Liu,Rong Sun
2023 24th International Conference on Electronic Packaging Technology (ICEPT)pp.1-6, (2023)
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Accurate Assessment of Young's Modulus of Sintered Ag Joints by Nanoindentation
Yuning Zhang,Liang Xu,Pengli Zhu,Tao Zhao,Rong Sun
2023 24th International Conference on Electronic Packaging Technology (ICEPT)pp.1-5, (2023)
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Key Factors for the Formation of Intermetallic Compound During Cu-Sn TLPB Process
Yuyan Ding,Tao Zhao,Pengli Zhu,Liang Xu,Rong Sun
2023 24th International Conference on Electronic Packaging Technology (ICEPT)pp.1-5, (2023)
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Effect of Young’s modulus on the reliability of sintered silver joints: simulation and experiment
Kuifu Cheng, Cheng Zhong, Yuning Zhang,Liang Xu,Xianwen Liang,Zhiqiang Lai,Dan Liu,Tao Zhao,Rong Sun
2023 24th International Conference on Electronic Packaging Technology (ICEPT)pp.1-5, (2023)
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Computational and experimental study of a novel L-Cysteine hydrochloride leveler for copper electroplated via fill in redistribution layers
Yu Jiao,Zhe Li, Xing-Quan Liu,Zhi-Quan Liu,Rong Sun
2023 24th International Conference on Electronic Packaging Technology (ICEPT)pp.1-5, (2023)
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