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Bio
Robert Patti recieved the BSEE/CS and BSPH degrees from Rose-Hulman Institute of Technology, Terre Haute, IN, USA. He is the owner and President of NHanced Semiconductors. He founded ASIC Designs Inc, an R&D company specializing in high-performance systems and ASICs. During his 12 years with ASIC Designs, he participated in the design of over 100 chips. Tezzaron Semiconductor grew from that company, with Bob as its CTO, and became a leading force in 3D-IC technology. Tezzaron built its first working 3D-ICs in 2004. NHanced Semiconductors was spun out of Tezzaron to further advance and develop 2.5D/3D technologies, chiplets, die and wafer stacking, and other advanced packaging. He was the recpient the SEMI Award for North America in 2009, served as Vice-Chairman of JEDEC's DDRIII / Future Memories Task Group, and holds 18 US patents, numerous foreign patents, and many more pending patent applications in deep sub-micron semiconductor chip technologies.
Research Interests
Papers共 10 篇Author StatisticsCo-AuthorSimilar Experts
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2024 IEEE Silicon Photonics Conference (SiPhotonics)pp.1-2, (2024)
IEEE Solid-State Circuits Letters (2024): 34-37
OFCpp.1-3, (2023)
VLSI Technology and Circuitspp.1-2, (2023)
JOURNAL OF LIGHTWAVE TECHNOLOGYno. 21 (2023): 6741-6755
2023 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXHIBITION, OFC (2023)
INFRARED TECHNOLOGY AND APPLICATIONS XLVI (2020)
2019 8th International Symposium on Next Generation Electronics (ISNE)pp.1-4, (2019)
Jaesub Hong,Branden Allen,Jonathan Grindlay,Hiromasa Miyasaka,Jill Burnham, Sankgi Hong, Wesker Lei,Scott Barthelmy,Robert Patti,Fiona Harrison
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