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个人简介
Richard Gaggl (Senior Member, IEEE) received the Dipl.-Ing. (M.S.) degree in computer science and electrical engineering and the Ph.D. (summa cum laude) degree in electrical engineering from the University of Technology, Graz, Austria, in 1997 and 2009, respectively. In 1996, he joined Siemens Semiconductor, where he worked as an analog design engineer on Voice-CODECs. From 1999 to 2009, he held several managing and design positions at Infineon Technologies Austria, working with the Wireline Communication Division. He developed entire Analog-Front Ends for Voice-, xDSL- and WLAN-systems. From 2009 to 2012, he was in charge of a mixed-signal design group at Lantiq Austria, where he managed and designed mixed-signal transceiver circuits for xDSL-, GPON- and Home-Networking solutions. Since 2012, he has been a Senior Principal Engineer of Mixed-Signal Design with Infineon Technologies Austria, where he is a Technical Leader for the design of consumer sensor ASICs in the field of silicon microphones, environmental sensors as well as time-of-flight imagers. His technical interests and expertise are in the field of oversampling a/d and d/a converters, analog and mixed-signal circuit design and the development of entire analog front-ends in advanced CMOS. He has contributed to more than 40 patents and has published and coauthored more than 50 journals- and conference- papers as well as book chapters. He is the author of the book Delta-Sigma A/D-Converters: Practical Design for Communication Systems (Springer, Berlin, Heidelberg, 2013). He is serving as a member of the Technical Program Committee for the European Solid-State Circuits Conference (ESSCIRC) in the Data Converter Subcommittee. In 2009, he received the Award of Excellence for his Ph.D. thesis bestowed by the Austrian Federal Minister of Science and Research.
研究兴趣
论文共 64 篇作者统计合作学者相似作者
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Conference on PhD Research in Microelectronics and Electronicspp.1-4, (2024)
Conference on PhD Research in Microelectronics and Electronicspp.1-4, (2024)
ISCASpp.1-5, (2023)
ESSCIRC 2023- IEEE 49th European Solid State Circuits Conference (ESSCIRC)pp.209-212, (2023)
2023 30th IEEE International Conference on Electronics, Circuits and Systems (ICECS)pp.1-4, (2023)
2023 30th IEEE International Conference on Electronics, Circuits and Systems (ICECS)pp.1-4, (2023)
2022 17th Conference on Ph.D Research in Microelectronics and Electronics (PRIME)pp.101-104, (2022)
INTERNATIONAL CONFERENCE ON ELECTRICAL, COMPUTER AND ENERGY TECHNOLOGIES (ICECET 2021)pp.1763-1766, (2021)
SMACD / PRIME 2021; International Conference on SMACD and 16th Conference on PRIMEpp.1-4, (2021)
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#Papers: 63
#Citation: 951
H-Index: 23
G-Index: 26
Sociability: 5
Diversity: 0
Activity: 0
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