检索
AI 对话
analysis
趋势分析
编组
开放平台
more
更多
排名必读论文期刊顶会热点AI 简史溯源树小脉星探人才迁徙塔尖人才国防情报追踪开源工具智慧手语
VIPCreated with Sketch.
研究兴趣

论文共 14 篇作者统计合作学者相似作者

按年份排序按引用量排序主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
Achieving zero EUV patterning defect with dry photoresist system
Mohammed Alvi,Richard Gottscho, Ali Haider, Seongjun Heo, PingYen Hsieh, Ching-Chung Huang,Gosia Jurczak,Benjamin Kam, Ji Yeon Kim, Billie Li, Da Li, Henry Nguyen,
Advances in Patterning Materials and Processes XXXIX (2022)
引用0浏览0引用
0
0
High-Z metal-based underlayer patterning for improving EUV stochastics (Conference Presentation)
Anuja De Silva,Jennifer Church, Dominik Metzler,Luciana Meli,Nelson M. Felix, Phil Friddle,Bhaskar Nagabhirava, Siva Kanakasabapathy,Rich Wise
Extreme Ultraviolet (EUV) Lithography XI (2020)
引用0浏览0引用
0
0
High-Z metal-based underlayer to improve EUV stochastics (Conference Presentation)
Anuja De Silva,Jennifer Church, Dominik Metzler,Luciana Meli, Phil Friddle,Bhaskar Nagabhirava,Rich Wise,Nader Shamma
International Conference on Extreme Ultraviolet Lithography 2019 (2019)
引用0浏览0引用
0
0
Unbiased Roughness Measurements: The Key to Better Etch Performance
Andrew Liang,Chris Mack, Stephen Sirard,Chen-wei Liang, Liu Yang, Justin Jiang,Nader Shamma,Rich Wise,Jengyi Yu, Diane Hymes
Proceedings of SPIE (2018)
引用3浏览0引用
3
0
Ultimate edge-placement control using combined etch and lithography system optimizations
Brennan Peterson,Rich Wise, Koen van der Straten,Katja Viatkina, Melisa Luca, Salman Mokhlespour, Michael Kubis,Giordano Cattani,David Hellin,Daniel Sobieski,Girish Dixit,Nader Shamma,
ADVANCES IN PATTERNING MATERIALS AND PROCESSES XXXV (2018): 16-23
引用0浏览0引用
0
0
加载更多
作者统计
  • 合作者
  • 学生
  • 导师
暂无相似学者，你可以通过学者研究领域进行搜索筛选
数据免责声明
页面数据均来自互联网公开来源、合作出版商和通过AI技术自动分析结果，我们不对页面数据的有效性、准确性、正确性、可靠性、完整性和及时性做出任何承诺和保证。若有疑问，可以通过电子邮件方式联系我们：report@aminer.cn