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Renzhi Liu (Senior Member, IEEE) received the B.Sc. and B.Econ. degrees from Peking University, Beijing, China, in 2010, and the Ph.D. degree in electrical engineering from Carnegie Mellon University, Pittsburgh, PA, USA, in 2015.
He was a Post-Doctoral Research Associate with Carnegie Mellon University in 2015. In 2016, he joined Intel Labs, Hillsboro, OR, USA, as a Research Scientist, where he is primarily researching on the low-power RF transceivers for emerging applications as well as mixed-signal solutions for in-memory computing and machine learning applications.
Dr. Liu received the Industry Paper Award First Place at IEEE Radio Frequency Integrated Circuits Symposium (RFIC) in both 2019 and 2022. He is currently serving as a member of Technical Program Committee for IEEE International Solid-State Circuits Conference (ISSCC) and IEEE Custom Integrated Circuits Conference (CICC).
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Renzhi Liu,K. T. Asma Beevi,Richard Dorrance, Timothy F. Cox,Rinkle Jain, Tolga Acikalin, Zhen Zhou,Tae-Young Yang, Johanny Escober-Pelaez,Shuhei Yamada, Kenneth P. Foust,Brent R. Carlton
IEEE JOURNAL OF SOLID-STATE CIRCUITSno. 5 (2023): 1285-1298
Renzhi Liu,Beevi K. T. Asma,Richard Dorrance, Timothy Cox,Rinkle Jain, Tolga Acikalin, Zhen Zhou,Tae-Young Yang, Johanny Escobar-Pelaez,Shuhei Yamada, Kenneth Foust,Brent Carlton
2022 IEEE Radio Frequency Integrated Circuits Symposium (RFIC)pp.263-266, (2022)
2019 IEEE RADIO FREQUENCY INTEGRATED CIRCUITS SYMPOSIUM (RFIC) (2019)
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