基本信息
浏览量:27
![](https://originalfileserver.aminer.cn/sys/aminer/icon/show-trajectory.png)
个人简介
Ren-Shing Cheng received the M.S. degree in materials and optoelectronic science from the National Sun Yat-sen University, Kaohsiung, Taiwan, in 2008.
He is currently an Research and Development Engineer with Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, Hsinchu, Taiwan. His current research interests include advance electronic package design and assembly technology and micro solder bump joints reliability analysis.
研究兴趣
论文共 30 篇作者统计合作学者相似作者
按年份排序按引用量排序主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
Ching Kuan Lee, Wen-Hung Liu, Shu-Yi Chang,Ren-Shin Cheng,Yu-Min Lin,Hsiang-En Ding,Wei-Lan Chiu,Tao-Chih Chang,Chia-Hsin Lee,Chang-Chun Lee
2022 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2022)pp.55-56, (2022)
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)pp.1076-1081, (2021)
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)pp.736-741, (2021)
International Symposium on Microelectronicsno. 1 (2015): 1-6
Electronic Components and Technology Conferencepp.290-296, (2014)
Yuwei Huang,Chaujie Zhan,Lin Yumin,Jingye Juang,Shinyi Huang,Sumei Chen,Chiawen Fan,Renshin Cheng, Shuhan Chao, C K Lin,Jiean Lin, Chih Chen
加载更多
作者统计
#Papers: 29
#Citation: 255
H-Index: 10
G-Index: 15
Sociability: 5
Diversity: 1
Activity: 0
合作学者
合作机构
D-Core
- 合作者
- 学生
- 导师
数据免责声明
页面数据均来自互联网公开来源、合作出版商和通过AI技术自动分析结果,我们不对页面数据的有效性、准确性、正确性、可靠性、完整性和及时性做出任何承诺和保证。若有疑问,可以通过电子邮件方式联系我们:report@aminer.cn