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个人简介
Rehan Khalid received the B.S. degree in mechanical engineering from the Ghulam Ishaq Khan Institute of Engineering Sciences and Technology, Topi, Pakistan, in 2012, and the M.S. degree in mechanical engineering from the Georgia Institute of Technology, Atlanta, GA, USA, in 2014. He is currently pursuing the Ph.D. degree in mechanical engineering with Villanova University, Villanova, PA, USA.
From 2012 to 2014, he was a Trainee Engineer with various national and multinational consulting firms on projects related to the energy sector.
Mr. Khalid was a recipient of the Fulbright Fellowship from the U.S. Department of State for pursuing his master’s degree.
研究兴趣
论文共 8 篇作者统计合作学者相似作者
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Journal of Electronic Packagingno. 2 (2023)
ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2021)
PROCEEDINGS OF ASME 2021 INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS (INTERPACK2021) (2021)
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ASHRAE TRANSACTIONS 2019, VOL 125, PT 1 (2019)
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IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 9 (2017): 1440-1452
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