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Rajesh Reddy Tummuru received the Diploma degree in electronics from Nettur Technical Training Foundation, Bangalore, India, in 2006, and the M.S. degree in microelectronics from the Birla Institute of Technology and Science, Bangalore, India, in 2011.
He joined Texas Instruments, Bangalore, where he was involved in the physical design of chips for high-speed data converter products. He joined the Microelectronics Division, IBM, Bangalore, in 2011, and he is involved in the physical design of test chips for process development in advanced deep-submicrometer processes. He has also done physical design for 3-D staking chips. He is also involved in the lithography evaluation of printability for the structures in eDRAM design in the emerging technologies. He has beenwith GLOBALFOUNDRIES, Bangalore, since 2015, where he is involved in silicon photonics technology development, packaging, and physical design of MTPM test chips.
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Eric Hunt-Schroeder,Darren Anand,John Fifield,Michael Roberge,Dale Pontius,Mark Jacunski,Kevin Batson, Matthew Deming,Faraz Khan,Dan Moy,Alberto Cestero,Robert Katz,
IEEE Solid-State Circuits Lettersno. 12 (2018): 233-236
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