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With proven success in operations, project/program leadership, R&D, product/process commercialization, and start-ups, Dr. Singh is a leading semiconductor and photovoltaic (PV) expert with over 35 years of industrial and academic experience of photovoltaic and semiconductor industries Dr. Rajendra Singh received the Ph.D. degree from McMaster University, Hamilton, Canada, in 1979. From 1979 to 1980, Dr. Singh was a Visiting Assistant Professor at both the University Of Waterloo, Canada and at Colorado State University, Fort Collins. In 1980, he joined Energy Conversion Devices, Inc. as Senior Research Scientist and worked on amorphous silicon solar cells and thermoelectric devices. Before coming to Clemson University, he was a Professor and the Director of the Microelectronics Laboratory at University of Oklahoma’s School of Electrical Engineering and Computer Science. In 1992, he joined Clemson University as the first D. Houser Banks Professor in the Department of Electrical and Computer Engineering. From 1996 to 1999, he served as the Director of the Materials Science and engineering Program at Clemson. In 1997, he became the Director of the Center for Silicon Nanoelectronics at Clemson. Dr. Singh is currently D. Houser Banks Professor in the Holcombe Department of Electrical and Computer Engineering and the Director of the Center for Silicon Nanoelectronics at Clemson University.
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论文共 51 篇作者统计合作学者相似作者
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The Advancing World of Applied Electromagneticspp.349-383, (2024)
Journal of Energy and Power Technologyno. 01 (2023): 1-19
BATTERIES-BASELno. 3 (2023): 169-169
2023 IEEE Fifth International Conference on DC Microgrids (ICDCM) (2023): 1-5
Sidra Khatoon,Satish Kumar Yadav, Vishwadeep Chakravorty,Jyotsna Singh,Rajendra Bahadur Singh,Md Saquib Hasnain,S.M. Mozammil Hasnain
Materials Science for Energy Technologies (2023): 437-459
Smart Innovation, Systems and Technologies Ubiquitous Intelligent Systems (2022): 35-43
2021 IEEE 48TH PHOTOVOLTAIC SPECIALISTS CONFERENCE (PVSC)pp.1821-1828, (2021)
2021 IEEE 32nd International Conference on Microelectronics (MIEL)pp.19-24, (2021)
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