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个人简介
Raj Pulugurtha Markondeya received the B.S. degree from IIT Kanpur, Kanpur, India, in 1993, the M.E. degree from the Indian Institute of Science, Bengaluru, India, in 1995, and the Ph.D. degree from Rutgers University, New Brunswick, NJ, USA, in 1999.
He is currently an Associate Professor with the Department of Biomedical Engineering and the Department of Electrical and Computer Engineering (ECE), Florida International University, Miami, FL, USA. He is also an Adjunct Professor with the ECE Department and the Packaging Research Center, Georgia Institute of Technology (Georgia Tech), Atlanta, GA, USA. He has been a Research Faculty, Georgia Tech PRC, for 19 years, where he mentored more than 25 M.S. and Ph.D. students. He coleads several technical thrusts in electronic packaging, working with the whole electronic ecosystem, which includes semiconductor, packaging and material, tool, and end-user companies. He is widely recognized for his contributions in integrated passive components and technology road mapping, component integration for bioelectronic, power, and RF modules and also for promoting the role of nanomaterials and nanostructures for electronics packaging applications, as evident through his several industry partnerships, invited presentations, publications, and awards. His research led to 330 publications that include 100 journal articles, 20 book chapters, and 200 conference publications. He holds eight patents with several other provisional patents and invention disclosures. His expertise is in packaging of electronic and bioelectronic systems, power-supply and wireless component integration in flex and rigid packages, and biocompatible and hermetic packaging with high-density feedthroughs.
Dr. Markondeya’s research led to more than 25 best paper awards. He is also an Associate Editor of the IEEE Transactions on Components, Packaging and Manufacturing Technology and the IEEE Nanotechnology Magazine, and the Co-Chair of the IEEE Nanopackaging Technical Committee. He has been instrumental in forming the “Nanopackaging” and “Heterogeneous Integration” technical sessions at various IEEE and Power Sources Manufacturers Association (PSMA) conferences. He has been actively involved with the PSMA and takes a proactive role in shaping up power electronics sessions at the Applied Power Electronics Conference (APEC) and Power, Energy and Intelligent Materials (PEIM) conference. He is also on the Steering Committee of the IEEE the Electronics Packaging Society (EPS) IoT Committee. He was a reviewer for about 100 journal articles. He is also an STEM Ambassador. He also frequently offers nanoscience and nanotechnology demonstrations at local schools and hosts K-12 field trips.
研究兴趣
论文共 311 篇作者统计合作学者相似作者
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IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 99 (2024): 1-1
IEEE NANOTECHNOLOGY MAGAZINEno. 2 (2024): 3-4
Journal of Materials Researchpp.1-10, (2024)
2024 International Applied Computational Electromagnetics Society Symposium (ACES)pp.1-2, (2024)
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IEEE NANOTECHNOLOGY MAGAZINEno. 2 (2024): 10-20
Mohammad Mohtasim Hamid Pial,Ghaleb Saleh Ghaleb Al-Duhni,Mudit Khasgiwala,Pulugurtha Markondeya Raj
2023 IEEE Design Methodologies Conference (DMC)pp.1-5, (2023)
2023 IEEE Nanotechnology Materials and Devices Conference (NMDC)pp.721-725, (2023)
2023 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (USNC-URSI)pp.953-954, (2023)
2023 Fourth International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)pp.1-5, (2023)
2023 Fourth International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)pp.1-6, (2023)
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作者统计
#Papers: 312
#Citation: 3239
H-Index: 25
G-Index: 36
Sociability: 6
Diversity: 1
Activity: 2
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