基本信息
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Bio
Quang-Diep Bui received the B.S. degree in electronics and telecommunications from the Hanoi University of Science and Technology, Hanoi, Vietnam, in 2001, and the M.S. and Ph.D. degrees in information and communications engineering from the Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Korea, in 2007 and 2013, respectively.
In 2013, he joined Samsung Electronics, Hwaseong, Korea, where he has been involved in the design and development of RF integrated circuits (RFICs) for wireless communications.
Research Interests
Papers共 16 篇Author StatisticsCo-AuthorSimilar Experts
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2021 IEEE Asia-Pacific Microwave Conference (APMC)pp.43-45, (2021)
2017 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE (ISSCC)pp.220-220, (2017)
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Jae-won Choi,Jong-Soo Lee,Yao Xi,Seong-sik Myoung,Sang-Hyun Baek, Dae Hyn Kwon,Quang-Diep Bui,Jaehun Lee, Dongjin Oh,Thomas Byunghak Cho
Hyunseok Choi,Quangdiep Bui,So Young Kang,Hiyeun Song,Dongmin Kang,Innyeal Oh,Chul Soon Park, Kwangjoo Choi, Bill Choi, Y Jin, Geonwook Lee
2012 IEEE 1st International Workshop on Vehicular Communications, Sensing, and Computing (VCSC)pp.5-9, (2012)
RF Front-ends for Software Defined and Cognitive Radio Solutionspp.1-4, (2010)
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Author Statistics
#Papers: 17
#Citation: 207
H-Index: 9
G-Index: 14
Sociability: 4
Diversity: 1
Activity: 0
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