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排名必读论文期刊顶会热点AI 简史溯源树小脉星探人才迁徙塔尖人才国防情报追踪开源工具智慧手语
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论文共 12 篇作者统计合作学者相似作者

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A Novel Scalable Modular Immersion Cooling System Architecture for Sustainable Data Center
Carrie Chen,Jiahong Wu,Jun Zhang, Ying-Shan Lo, Allen Liang, Checa Hung,Nishi Ahuja,Qing Qiao
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)pp.1-7, (2023)
引用0浏览0EIWOS引用
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Data Center Power Density Rack Evolution with 54V for Sustainable Computing
Sheng Li,Guofeng Chen,Guilin Wang,Yuehlin Tsai,Jun Zhang,Jialiang Xu,Hongxing Zhou, Ming Gao,Nishi Ahuja,Qing Qiao
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)pp.1-6, (2023)
引用0浏览0EIWOS引用
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A Novel Cost Efficient Cold Plate Liquid Cooling Solution for Data Center Deployment
Zhenghui Wu,Yongzhan He, Jianwu Zheng, Bing Cheng,Jun Zhang,Wenqing Lv, Min Wu, Ying He, Pengfei Yue,Nishi Ahuja,Qing Qiao
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)pp.1-7, (2023)
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High Power Density Rack Design Optimal for Hyper Scale Data Center Carbon Emission Reduction
Zhenghui Wu,Yongzhan He, Jianwu Zheng, Bing Cheng, Jun Zhang, Min Wu,Wenqing Lv, Ying He, Pengfei Yue,Nishi Ahuja,Qing Qiao
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)pp.1-6, (2023)
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A Novel Outdoor Edge Server Design with Hybrid Air Cooling and Refrigeration
Liwen Guo, Tzuchun Hung,Cheng-Hua Huang,Minghua Duan,Chiming Jao, Vinson Lin,Robert Yuan,Dechao Kong, Hai Du,Xiaojin Fan, Dong Xun,Jun Zhang,
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)pp.1-5, (2022)
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An Advanced Mechanical and Thermal Design Optimal For High Density Storage Server Reliability
Shiqiang Zheng, Zhilin Zheng,Hongmei Liu, Weihua Cao, Xin Wang,Jiajun Zhang,Jun Zhang,Yingqiong Bu, Xingping Ruan,Qing Qiao
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)pp.1-7, (2022)
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An Advanced Cold Plate Liquid Cooling Rack Design for Hyperscale Data Center
Yuehlin Tsai,Guilin Wang, Yuehong Jin, Sheng Li, Wenyi Fang,Guofeng Chen, Peng Cao,Jun Zhang,Yuehong Fan,Yuyang Xia,Wenbin Tian,Hang Cheng,
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)pp.1-5, (2022)
引用3浏览0EIWOS引用
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A Novel Cost-Efficient High-Performance Aluminum Cold Plate Solution for Liquid Cooling System
Xianguang Tan, Li Su,Hongmei Liu,Jiajun Zhang,Jun Zhang,Lijuan Feng,Wenbin Tian, Allen Liang,Hang Cheng,Nishi Ahuja,Qing Qiao
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)pp.1-4, (2022)
引用2浏览0EIWOS引用
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An Advanced Fan-less AIoT Smart Edge Gateway with Thickness Thermal Pad Design
Huayong Yuan, Wei Chen, Michael King, Aaron Wu, Barry Chen, Clio Chiu, Karen Tseng, Lulu Su, Richard Chang, Ryan Yang, Shoes Leu, Allen Liang,
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)pp.1-5, (2022)
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Advanced Single-phase Passive Immersion Cooling Solution with Natural Convection for Outdoor Edge Servers
Liwen Guo,Jiahong Wu,I-Min Hsieh,Cheng-Hua Huang,Bo Li,Chiming Jao, Vinson Lin,Robert Yuan,Xianguang Tan,Xiaojin Fan,Zhenghui Wu,Yong Sheng,
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)pp.417-422, (2021)
引用1浏览0EIWOS引用
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