Qianwen Chen - TJ Watson Res Ctr, IBM Corp

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论文共 13 篇作者统计合作学者相似作者

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Scalable Advanced DBHi Chiplet Package Using Silicon Bridge with 30 Μm-Pitch Solder Joints

Akihiro Horibe,Takahito Watanabe,Chinami Marushima,Sayuri Kohara,Yasuharu Yamada,Hiroyuki Mori,Divya Taneja, Katherine Pilger, Alexis Jacques-Fortin, Maxime Godard,Qianwen Chen,Eric Perfecto,Aakrati Jain, Joseph R. Ross,Thomas Wassick,Isabel de Sousa

PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024pp.269-273, (2024)

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An Evaluation of Bath Life Effects on Photoresist Removal for Wafer Level Packaging

Joel A. Bahena,Phillip Tyler,John Taddei,Muthumanickam Sankarapandian, Jamie Prudhomme, Karthikeyan Pillai, Abdullahi Said, Christopher Carr,Dario Goldfarb, Chris Waskiewicz,Qianwen Chen

IMAPSource Proceedingsno. Issue 1 (2023)

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Next Generation Infrared (IR) Laser Debonding / Silicon Handle Technology for Precision Chiplet Technology Applications

Qianwen Chen,Michael Belyansky,Yasir Sulehria,Akihiro Horibe, Liqiao Qin,Ruturaj Pujari,Eric Perfecto,Fee Li Lie,Shahid Butt, Nick Polomoff,Risa Miyazawa,Sayuri Kohara,Mukta Farooq,Takashi Hisada,Jennifer Oakley,Spyridon Skordas,Susan Fan,Katsuyuki Sakuma,John Knickerbocker,Dale Mcherron,Takeshi Tamura,Takayuki Ishii, Panupong Jaipan, Satoshi Nishimura,Ilseok Son,Yohei Maeda,Takashi Koga, Joseph Klein, Kei Tashiro,Sitaram Arkalgud,Yoshihiro Kondo

2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1175-1180, (2023)

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健康管理とモノのインターネット(IoT)応用のためのマイクロ薄膜電池シーリングへのパネルパッケージングアプローチ【JST・京大機械翻訳】

Qianwen Chen,Bing Dang,Leanna Pancoast,Nah Jae-woong,Knickerbocker John,Shih Andy, Cheng Bo Wen, Liu Kai,Meng-Nian Niu,Nieh Simon

IEEE Conference Proceedings (2020): 1560-1565

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Panel Packaging Approach to Micro Thin-film Battery Sealing for Healthcare and Internet of Things (iot) Applications

Qianwen Chen,Bing Dang,Leanna Pancoast,Jae-woong Nah,John Knickerbocker,Andy Shih, Bo Wen Cheng,Kai Liu,Mengnian Niu,Simon Nieh

2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020)（2020）

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Novel Packaging Structure and Processes for Micro-TFB (Thin Film Battery) to Enable Miniaturized Healthcare Internet-of-Things (IoT) Devices

Bing Dang,Qianwen Chen,Leanna Pancoast,Yu Luo,Hongqing Zhang,Jae-woong Nah,John Knickerbocker,Andy Shih, Po Wen Cheng,Kai Liu,Mengnian Niu,Simon Nieh

Electronic Components and Technology Conference（2019）

引用7浏览0EIWOS引用

Heterogeneous Integration Technology Demonstrations for Future Healthcare, IoT, and AI Computing Solutions

J. U. Knickerbocker,R. Budd,B. Dang,Q. Chen,E. Colgan,L. W. Hung, S. Kumar, K. W. Lee,M. Lu,J. W. Nah, R. Narayanan,K. Sakuma,V. Siu,B. Wen

2018 IEEE 68th Electronic Components and Technology Conference (ECTC)（2018）

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High-Speed Precision Handling Technology of Micro-Chip for Fan-Out Wafer Level Packaging (FOWLP) Application

Qianwen Chen,Li-Wen Hung,Evan Colgan,Bo Wen,Bing Dang,Russell Budd,Jae-Woong Nah,John Knickerbocker

Electronic Components and Technology Conference（2018）

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Column Interconnects: A Path Forward for Embedded Cooling of High Power 3D Chip Stacks

Mark D. Schultz,Cyril Cabral Jr. Joana Maria,Paul Andry,Qianwen Chen,Timothy Chainer,Cornelia Tsang

2018 IEEE 68TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2018)（2018）

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Feasibility Study of Si Handler Debonding by Laser Release

Bing Dang,Tom Wassick, Yang Liu,Qianwen Chen,Paul Andry,Li-wen Hung,Hongqing Zhang,Jeffrey Gelorme,John Knickerbocker

2016 IEEE 66th Electronic Components and Technology Conference (ECTC)（2016）

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