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个人简介
Pooya Tadayon received the B.S. degree in chemistry from the University of Washington, Seattle, WA, USA, in 1993 and the Ph.D. degree in physical chemistry from Oregon State University, Corvallis, OR, USA, in 1998. From 1998 to 2018, he was a Technologist with Intel's Assembly and Test Technology Development Group. He is currently an Intel Fellow and Director of Assembly and Test Pathfinding, Intel's Ronler Acres campus, Hillsboro, OR, USA. He holds 28 patents, with more than three dozen patents pending, spanning the fields of test interconnect technology and package or product architecture. His current research focuses on advanced packaging technologies to enable 2.5/3D ICs and assembly/test solutions for co-packaged photonics that can scale to high volume.
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论文共 7 篇作者统计合作学者相似作者
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Ravi Mahajan,Xiaoqian Li, Joshua Fryman,Zhichao Zhang,Srikant Nekkanty,Pooya Tadayon,James Jaussi,Sergey Shumarayev,Ankur Agrawal, Susheel Jadhav,Kumar Abhishek Singh,Andrew Alduino,
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)pp.86-92, (2021)
Nilesh Badwe, Paresh Daharwal, Taylor Rawlings,Paul Diglio,Sarah Wozny,Mohit Khurana,Pooya Tadayon,George Hsieh, Mukul Renavikar
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)pp.365-377, (2021)
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)pp.350-364, (2021)
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