谷歌浏览器插件
订阅小程序
在清言上使用
VIPCreated with Sketch.
研究兴趣

论文共 54 篇作者统计合作学者相似作者

按年份排序按引用量排序主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
2 Μm Pitch Direct Die-to-Wafer Hybrid Bonding Using Surface Protection During Wafer Thinning and Die Singulation
Ye Lin,Pieter Bex,Samuel Suhard, Boyao Zhang, Fulya Ulu Okudur, Amaia Diaz De Zerio, Naveen Reddy, Efrain Altamirano Sanchez, Yanan Li,Anne Jourdain,Gerald Beyer,Eric Beyne
2025 IEEE 75th Electronic Components and Technology Conference (ECTC)pp.272-276, (2025)
引用0浏览0EIWOS引用
0
0
Multi-tier Die Stacking Through Collective Die-to-wafer Hybrid Bonding
Koen Kennes, Ye Lin,Samuel Suhard,Pieter Bex,Dieter H. Cuypers,Alice Guerrero, Dennis Bumueller,Alain Phommahaxay,Gerald Beyer,Eric Beyne
PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024pp.637-642, (2024)
引用0浏览0EIWOS引用
0
0
Direct Die-to-Wafer Hybrid Bonding Using Plasma Diced Dies and Bond Pad Pitch Scaling Down to 2 Μm
Ye Lin,Pieter Bex,Koen Kennes,Jaber Derakhshandeh, Prathamesh Dhakras,Samuel Suhard,Carine Gerets,Sven Dewilde, Violeta Georgieva,Anne Jourdain,Gerald Beyer,Eric Beyne
PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024pp.40-44, (2024)
引用0浏览0EIWOS引用
0
0
Overlay Scaling Error Reduction for Hybrid Die-to-Wafer Bonding
Pieter Bex,Mario Gonzalez,Steven Brems,Alain Phommahaxay,Koen D'Havé, Prathamesh Dhakras,Dieter H. Cuypers, Ye Lin,Eric Beyne, Jonathan Abdilla, Kawsar Ahmed Prince, Benedikt Auer, Djuro Bikaljevic, Manuel Deubler, Thiago Moura, Stefan Schmid, Pavel Seroglazov
2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)pp.1-6, (2024)
引用0浏览0EIWOS引用
0
0
Integration of Plasma Dicing in the Collective Die to Wafer Hybrid Bonding Process
Samuel Suhard,Koen Kennes,Pieter Bex, Violeta Georgieva,Filip Schleicher,Edward Walsby, Richard Barnett,Anne Jourdain,Gerald Beyer,Eric Beyne
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.144-149, (2023)
引用0浏览0EIWOS引用
0
0
Carrier Systems for Collective Die-to-Wafer Bonding
Koen Kennes,Alain Phommahaxay,Alice Guerrero,Samuel Suhard,Pieter Bex,Steven Brems,Xiao Liu, Sebastian Tussing,Gerald Beyer,Eric Beyne
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (2022)
引用11浏览0EIWOS引用
11
0
加载更多
作者统计

#Papers: 53

#Citation: 311

H-Index: 11

G-Index: 15

Sociability: 5

Diversity: 2

Activity: 1

  • 合作者
  • 学生
  • 导师
暂无相似学者，你可以通过学者研究领域进行搜索筛选
数据免责声明
页面数据均来自互联网公开来源、合作出版商和通过AI技术自动分析结果，我们不对页面数据的有效性、准确性、正确性、可靠性、完整性和及时性做出任何承诺和保证。若有疑问，可以通过电子邮件方式联系我们：report@aminer.cn