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排名必读论文期刊顶会热点AI 简史溯源树小脉星探人才迁徙塔尖人才国防情报追踪开源工具智慧手语
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论文共 26 篇作者统计合作学者相似作者

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Detection of bonding voids in multi-tier stacks with scanning acoustic microscope
Cong Chen, John Slabbekoorn,Janusz Bogdanowicz,Alain Moussa, Boyao Zhang,Filip Schleicher,Peter Hoffrogge, Ingo Wiesler, Wassim Khaldi,Alain Phommahaxay,Christophe Beral,Gerald Beyer,
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.320-325, (2023)
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High throughput scanning probe metrology for high-NA EUV photoresist profiling
Artem Khatchaturiants,Marta Mucientes,Arseniy Kalinin, Yan Guo, Seokhan Kim, Alain Moussa,Janusz Bogdanowicz,Joren Severi,Gian F. Lorusso,Danilo De Simone, Anne-Laure Charley,Philippe Leray,
Metrology, Inspection, and Process Control XXXVI (2022)
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High Sensitivity Repeater Detection With Broadband Plasma Optical Wafer Inspection For Mask Defect Qualification
Andrew Cross,Kaushik Sah,Vidyasagar Anantha, Balarka Gupta, Ramon Ynzunza, Neil Troy, Kenong Wu,Raghav Babulnath, Meghna Rajendran, Dieter Van Den Heuvel,Philippe Leray
EXTREME ULTRAVIOLET LITHOGRAPHY 2020 (2020)
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Ultimate edge-placement control using combined etch and lithography system optimizations
Brennan Peterson,Rich Wise, Koen van der Straten,Katja Viatkina, Melisa Luca, Salman Mokhlespour, Michael Kubis,Giordano Cattani,David Hellin,Daniel Sobieski,Girish Dixit,Nader Shamma,
ADVANCES IN PATTERNING MATERIALS AND PROCESSES XXXV (2018): 16-23
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