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Bio
His main interests are materials for new power devices, modelling of power devices and circuits, power integrated circuits. He has also worked extensively on development of device simulation algorithms, as well as optoelectronic and quantum based device structures.
Professor Mawby is on many international conference committees including, ISPSD, EPE, BCTM and ESSDERC. He is Chartered Engineer, a Fellow of the IET, and a Fellow of the Institute Physics as well as a Senior Member of the IEEE. He has published over 70 Journal papers and 100 conference papers, and is a distinguished lecturer for the IEEE Electron devices society.
Professor Mawby is on many international conference committees including, ISPSD, EPE, BCTM and ESSDERC. He is Chartered Engineer, a Fellow of the IET, and a Fellow of the Institute Physics as well as a Senior Member of the IEEE. He has published over 70 Journal papers and 100 conference papers, and is a distinguished lecturer for the IEEE Electron devices society.
Research Interests
Papers共 427 篇Author StatisticsCo-AuthorSimilar Experts
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Ioannis Almpanis,Marina Antoniou,Paul Evans,Lee Empringham,Peter Gammon, Florin Undrea,Philip Mawby, Neophytos Lophitis
IEEE Transactions on Industry Applicationsno. 99 (2024): 1-13
Applied Physics Lettersno. 19 (2024)
Oleksii Zinchenko,Simon Mendy,Xiaoyun Rong, Kyrylo Melnyk,Amr Saleh,Olayiwola Alatise,Philip Mawby,Mohamed Taha
Xu Zhang,Nikolaos Iosifidis, Haiyong Wan, Jinxiao Wei,Li Ran,Philip Mawby,Kangning Wu,Jianying Li,Laili Wang
2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia)pp.1292-1296, (2024)
2023 IEEE Conference on Power Electronics and Renewable Energy (CPERE)pp.1-8, (2023)
12th International Conference on Power Electronics, Machines and Drives (PEMD 2023) (2023): 196-202
12th International Conference on Power Electronics, Machines and Drives (PEMD 2023) (2023): 211-217
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)no. EMPC (2023): 1-5
Arne Benjamin Renz, Qin Ze Cao,Oliver J. Vavasour,James Gott, P. M. Gammon,Tianxiang Dai, G. W. C. Baker,Phillip A. Mawby, V. A. Shah
Materials Science Forum (2023): 147-151
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)no. EMPC (2023): 1-7
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