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Papers共 62 篇Author StatisticsCo-AuthorSimilar Experts

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A comprehensive methodology for criticality assessment of microvias in printed circuit board assemblies
Vikram G Kamble, Dhaval Rasheshkumar Patel,Christian Schipfer,Andreas Thalhamer, Julia Zuendel,Thomas Krivec,Thomas Antretter,Peter Filipp Fuchs
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-7, (2024)
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Exploring the Impact of Laser Drilling on Material Thermal Decomposition: A Computational Study Using KratosMultiphysics
Chongnan Peng,Qi Tao,Thomas Krivec,Guillermo Casas,Salvador Latorre,Thomas Antretter,Johannes Macher,Peter Fuchs
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-7, (2024)
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Warpage Optimization of Package Substrates Using Metamodels - A Review
Fredy John Porathur, Vikram G Kamble, Eduard Stadler,Fabian Huber,Dieter P. Gruber,Peter Filipp Fuchs
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-9, (2024)
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Literature Review: Global Criticality Assessment Based on Feature Surrogates at the PCBA Levels
Qiulin Yu, Vikram G. Kamble,Dieter P. Gruber,Peter F. Fuchs, Karl Fendt,Thomas Krivec
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-12, (2024)
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FEM simulation of influence of different polymeric module materials and layouts on thermomechanical deformations in strings of shingled solar cells
Margit Lang,Gernot Oreski,Eric Helfer,Peter Fuchs,Andreas Halm,Markus Klenk
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-8, (2023)
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Evaluation of thermomechanical behavior of electronic devices through the use of a reduced order modelling approach
M. Weninger,J. Zündel,T. Krivec,M. Frewein, S. Waschnig,P. Fuchs, C. Obst
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-5, (2023)
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Prediction of thermo-mechanical properties of PCB conductive layers using convolutional neural networks
Mariia Shevchuk,Christian Schipfer, Matthias Haselmann,Qi Tao,Peter Fuchs
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-6, (2023)
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Author Statistics

#Papers: 64

#Citation: 398

H-Index: 12

G-Index: 17

Sociability: 5

Diversity: 0

Activity: 2

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