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个人简介
Pei-Ing Lee received the B.S. degree from the Department of Materials and Manufacturing Engineering, Universiti Tunku Abdul Rahman, Kampar, Malaysia, in 2018. She is currently pursuing the Ph.D. degree with the Institute of Materials Science and Engineering, National Taiwan University, Taipei, Taiwan.
Her research interests include Ag alloy wire, Si wafer backside grinding–backside metallization (BGBM) interface, and power IC packaging.
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论文共 16 篇作者统计合作学者相似作者
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INTERNATIONAL JOURNAL OF MANUFACTURING MATERIALS AND MECHANICAL ENGINEERINGno. 1 (2024): 1-11
Proceedings of the 8th World Congress on Mechanical, Chemical, and Material Engineering World Congress on Mechanical, Chemical, and Material Engineering (2022)
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 6 (2022): 933-938
Kuan-Yu Chiu,Pei-Ing Lee
International Journal of Mining, Materials, and Metallurgical Engineering (2022)
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 1 (2022): 37-41
International Journal of Manufacturing, Materials, and Mechanical Engineeringno. 1 (2022): 1-16
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