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个人简介
Stephan Paredes was born in Puno, Peru. He received the B.S. degree in systems engineering, majoring in physics engineering from the University of Applied Science Neu-Technikum Buchs, Buchs, Switzerland, in 2000, and the Post-Diploma degree in optical systems engineering in 2004.
He was with the Institute for Microsystems, Buchs, from 2001 to 2004, in the field of microelectromechanical systems, optical packaging, and waveguide technology for optical interconnects. From 2004 to 2007, he was involved in the development of optical interconnects and packaging technology for printed circuit boards at Varioprint AG, Heiden, Switzerland. In 2008, he joined the IBM Zurich Research Laboratory, Zurich, Switzerland, where he is currently working with the Advanced Thermal Packaging Group. His current research interests include microprocessor liquid cooling and improved thermal interfaces.
研究兴趣
论文共 65 篇作者统计合作学者相似作者
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APPLIED PHYSICS LETTERSno. 26 (2023)
T. Brunschwiler,J. Weiss,S. Paredes,A. Sridhar, U. Pluntke, S. Mai Chau,S. Gerke, J. Barroso,E. Loertscher,Y. Temiz,P. Ruch,B. Michel,
Ruch Patrick W.,Hu Rui,Capua Luca,Temiz Yuksel,Paredes Stephan, Marin Antonio Lopez, Carmona Jorge Barroso,Cox Aaron,Nakamura Eiji,Matsumoto Keiji
2019 IEEE International Symposium on Olfaction and Electronic Nose (ISOEN)pp.1-3, (2019)
user-5f8cf7e04c775ec6fa691c92(2018)
引用11浏览0引用
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T. Chainer, P. R. Parida, M. Schultz, F. Yang,M. Gaynes,G. Mcvicker,A. Sridhar,S. Paredes, O. Ozsun,T. Brunschwiler,U. Drechsler, E. Colgan,
2018 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE (IITC)pp.185-187, (2018)
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R. Straessle,S. Gerke,T. Brunschwiler,Y. Temiz,J. Weiss,A. Sridhar,S. Paredes,E. Loertscher,N. Ebejer,B. Michel, H. -M. Lee, C. Alvarado,
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作者统计
#Papers: 65
#Citation: 1666
H-Index: 24
G-Index: 39
Sociability: 5
Diversity: 2
Activity: 8
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