基本信息
浏览量:1
职业迁徙
个人简介
暂无内容
研究兴趣
论文共 30 篇作者统计合作学者相似作者
按年份排序按引用量排序主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
Pardeep Shahi,Ali Heydari,Satyam Saini,Pratik Bansode,Uschas Chowdhury, Harold Miyamura, Himanshu Modi,Dereje Agonafer, Mohammad Tradat,Jeremy Rodriguez
HEAT TRANSFER RESEARCHno. 7 (2024): 39-56
引用0浏览0引用
0
0
Himanshu Modi,Pardeep Shahi, Vibin Shalom Simon, Lochan Sai Reddy Chintaparthy,Gautam Gupta, Akiilessh Sivakumar,Satyam Saini,Pratik Bansode,Dereje Agonafer
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)pp.1-8, (2023)
引用0浏览0EIWOS引用
0
0
2023 39th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)pp.1-6, (2023)
引用0浏览0EIWOS引用
0
0
Ali Heydari, Qusai Soud,Mohammad Tradat,Ahmad Gharaibeh, Naimeh Fallahtafti,Pardeep Shahi,Jeremy Rodriguez,Bahgat Sammakia
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)pp.1-5, (2023)
引用0浏览0EIWOS引用
0
0
Pratik Bansode,Gautam Gupta, Mohan Sai Ramalingam, Vivek Nair, Sai Abhideep Pundla,Satyam Saini,Pardeep Shahi,Dereje Agonafer, Metodi Zlatinov, Denver Schaffarzick
SSRN Electronic Journal (2023)
引用0浏览0引用
0
0
ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2022)
Himanshu Modi,Pardeep Shahi, Lochan Sai Reddy Chinthaparthy,Gautam Gupta,Pratik Bansode, Vibin Shalom Simon,Dereje Agonafer
ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2022)
引用0浏览0引用
0
0
Journal of Enhanced Heat Transferno. 1 (2022): 35-52
加载更多
作者统计
合作学者
合作机构
D-Core
- 合作者
- 学生
- 导师
数据免责声明
页面数据均来自互联网公开来源、合作出版商和通过AI技术自动分析结果,我们不对页面数据的有效性、准确性、正确性、可靠性、完整性和及时性做出任何承诺和保证。若有疑问,可以通过电子邮件方式联系我们:report@aminer.cn