基本信息
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Bio
Paul Paret (Member, IEEE) received the B.Tech. degree in mechanical engineering from the College of Engineering Trivandrum, Thiruvananthapuram, India, in 2009, and the M.S. degree in aerospace engineering sciences from the University of Colorado Boulder, Boulder, CO, USA, in 2012. He also completed a certification in scientific computing from the University of Washington, Seattle, WA, USA, in 2020.
He is currently a Researcher with the Center for Integrated Mobility Sciences, Advanced Power Electronics and Electric Machines Group, National Renewable Energy Laboratory, Golden, CO, USA. In this role, he leads the computational modeling efforts to simulate the thermal and thermomechanical behavior and develop lifetime prediction models of various bonded materials in power electronics packages used in electric-drive vehicles and aviation systems. He conducts design optimization studies to identify the optimal component layers and geometry within power electronics package topologies to improve their power density, efficiency, and reliability. He has published several articles including journals, conference papers, technical reports, and a book chapter on the thermomechanical performance and lifetime prediction models of power electronics materials.
Mr. Paret is a Member of the Institute of Electrical and Electronics Engineers and American Society of Mechanical Engineers. He was a recipient of the Outstanding Paper Award (second place) at the 2013 ASME InterPACK Conference and the 2016 Research and Development 100 Award.
Research Interests
Papers共 33 篇Author StatisticsCo-AuthorSimilar Experts
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IEEE TRANSACTIONS ON POWER ELECTRONICSno. 1 (2024): 507-516
Paul Paret,Sri Krishna Bhogaraju,Dirk Busse, Alexander Dahlbüdding, Gordon Elger, Sreekant Narumanchi
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.1219-1224, (2024)
2023 IEEE Energy Conversion Congress and Exposition (ECCE)pp.5934-5938, (2023)
Journal of Electronic Packagingno. 3 (2023)
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)pp.1-6, (2023)
ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2022)
ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2022)
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Author Statistics
#Papers: 33
#Citation: 190
H-Index: 10
G-Index: 13
Sociability: 5
Diversity: 0
Activity: 1
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