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Bio
Dr. Patrick McCluskey (Ph.D., Materials Science and Engineering, Lehigh University, Bethlehem, PA) is an Associate Professor of Mechanical Engineering at the University of Maryland, College Park. He conducts research at the Center for Advanced Life Cycle Engineering (CALCE) in the areas of thermal management, reliability, and packaging of electronic systems for use in extreme temperature environments and high power applications.
Dr. McCluskey has published more than 100 refereed technical articles on these subjects, and has edited three books. He has also served as technical chairman for multiple international conferences and workshops. He is an associate editor of the IEEE Transactions on Components and Packaging.
Dr. McCluskey has performed extreme temperature and power electronics research and provided consulting and short courses for companies in the aerospace, automotive, motor drives, energy exploration and generation, and defense industries. He is a fellow of the International Microelectronics and Packaging Society (IMAPS), and is a member of ASME, IEEE, and SAE.
Research Interests
Papers共 196 篇Author StatisticsCo-AuthorSimilar Experts
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G. Nave,P. McCluskey
Journal of Electronic Materialsno. 3 (2024): 1239-1254
IMAPS symposia and conferencesno. HiTEN (2023)
Journal of Electronic Packagingno. 1 (2023)
Jin Wang,Thomas Jahns,Patrick McCluskey,John Kizito,Bulent Sarlioglu, Robert Borjas,James Swanke,Yizhou Cong,Zhaoxi Yao, Hao Zeng,Pengyu Fu,Alec Schnabel
IEEE Journal of Emerging and Selected Topics in Power Electronicsno. 99 (2023): 1-1
G. Nave,P. McCluskey
TMS 2023 152nd Annual Meeting & Exhibition Supplemental Proceedingspp.897-908, (2023)
2022 North American Power Symposium (NAPS)pp.1-6, (2022)
2022 IEEE/AIAA TRANSPORTATION ELECTRIFICATION CONFERENCE AND ELECTRIC AIRCRAFT TECHNOLOGIES SYMPOSIUM (ITEC+EATS 2022)pp.1082-1086, (2022)
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)pp.1-6, (2022)
PROCEEDINGS OF ASME 2022 INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, INTERPACK2022 (2022)
ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2021)
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Author Statistics
#Papers: 193
#Citation: 3521
H-Index: 28
G-Index: 53
Sociability: 6
Diversity: 1
Activity: 1
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